Technology >> CEO Interviews >> December 19, 2003

RICK GOERNER – TRANSDIMENSION INC

RICK GOERNER joined TransDimension as President and CEO in February 2002. As President and CEO, Goerner has leveraged his 30+ years of experience in the semiconductor industry to lead the company's next phase of revenue growth and product development of embedded interconnectivity solutions for PC peripheral and mobile markets. Goerner is also President and CEO of the company's wholly owned subsidiary, SoftConnex, which provides USB-enabling software solutions that support TransDimension's silicon and IP product offerings. Prior to TransDimension, Goerner was President and Chief Operating Officer of the Texas Instruments/Silicon Systems Storage Products Group, a business unit with over $1 billion in revenue. Before its acquisition by Texas Instruments, Goerner held senior management, business unit, marketing and sales positions at Silicon Systems/TDK Group Company, culminating in his role as Chief Operating Officer, Office of the President. During his 17-year tenure, Silicon Systems experienced revenue growth from $15 million to over $500 million. Goerner has also held senior sales and marketing positions with Signetics Corporation, a Philips Group Company, and Teledyne Semiconductor. Goerner serves as a member of TransDimension's Board of Directors and participates on the Board of Directors and advisory boards of several high tech companies in Orange County. Profile
TWST: Can we start off with an overview of TransDimension?

Mr. Goerner: We are a fabless semiconductor company that makes

integrated solutions in silicon and software for USB connectivity,