TWST: Would you begin with a brief history and an overview of your
company?
Mr. von Windheim: We are a startup in the electronics thermal management
space. The problem that we are trying to solve in this space is hot spot
cooling in semiconductors. That's a challenge that's becoming of
increasing concern because of the increasing density of transistors in
semiconductors. We have a device that is about the size of a piece of
confetti. When you run electrical current through this device, it cools
down. We insert it into the semiconductor package to cool the hottest
part of the semiconductor in that package.
TWST: What existing materials are in use and what are your advantages
over them?
Mr. von Windheim: Currently, what we do ' which is active localized
cooling within the package ' is not being done. The way that
semiconductors are cooled right now is with so-called passive solutions.
Basically, you have a heat spreader, a heat sink, and a fan that's
cooling the device. What we are doing is introducing an active cooling
solution directly into the semiconductor package to cool the hottest
part of the semiconductor right at its source. So that part of it is new
and different and has not been done with passive solutions.
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